Julie Raulin joins industry leaders to explore next-generation AI interconnect technologies at ECOC 2026
Industry experts will examine scale-up and scale-out architectures designed to support future AI infrastructure
- Speakers: Julie Raulin, senior engineer for advanced technology at Adtran (moderator); Daniel Kuchta, principal hardware system architect at Nvidia (moderator); Lidia Galdino, senior optical systems engineer at Corning (moderator); Connie Chang-Hasnain, chairperson and founder of Berxel (moderator); Paul Gunning, principal researcher at BT (moderator); Ryan Yu, founder and CEO at TeraHop; Peter Ossieur, technical program manager at IMEC; Peter O'Brien, head of photonics packaging and systems integration at Tyndall National Institute; Sylvie Menezo, CEO and co-founder at Scintil Photonics; Chris Wu, market and technology development manager at Corning; William Fegadolli, principal researcher at Nokia; Manish Mehta, SVP and GM of optical systems division at Broadcom; Fotini Karinou, principal network architect at Microsoft Azure; Claudia Hössbacher, VP of optical systems engineering at Marvell; Jean Philippe Fricker, chief architect at Cerebras; Ling Liao, senior director at Nvidia; Andy Bechtolsheim, chief development officer and chairperson at Arista Networks
- Topics: Winning interconnects for AI: Scale-up and scale-out technology paths
- When: Monday, September 21, 2 p.m. to 6:15 p.m. CEST
- Where: ECOC 2026, The Malaga Trade Fair and Conference Center (FYCMA), Málaga, Spain https://ecoc2026.org/ecoc2026
The rapid growth of AI workloads is driving unprecedented demand for bandwidth across computing and networking infrastructure. As AI models and datasets continue to scale, the industry is rethinking how systems are designed, connected and optimized. Modern AI environments increasingly rely on a combination of scale-up architectures that tightly integrate compute, memory and switching resources, and scale-out networks that connect vast numbers of AI systems across the data center.
In this symposium, Julie Raulin will co-moderate discussions among industry leaders exploring the technologies shaping the future of AI connectivity. The sessions will examine advances in optical interconnects, silicon photonics, co-packaged optics and networking architectures, highlighting how the industry is addressing the performance, power and scalability requirements of next-generation AI infrastructure. Attendees will gain insight into the architectural and optical innovations expected to support the next generation of high-performance AI systems.